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P89LPC9211FDH 数据表(PDF) 68 Page - NXP Semiconductors |
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P89LPC9211FDH 数据表(HTML) 68 Page - NXP Semiconductors |
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68 / 75 page ![]() P89LPC92X1 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 2 — 1 December 2010 68 of 75 NXP Semiconductors P89LPC9201/9211/922A1/9241/ 8-bit microcontroller with 8-bit ADC 13. Package outline Fig 37. TSSOP20 package outline (SOT360-1) UNIT A1 A2 A3 bp cD (1) E (2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 6.6 6.4 4.5 4.3 0.65 6.6 6.2 0.4 0.3 0.5 0.2 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT360-1 MO-153 99-12-27 03-02-19 w M b p D Z e 0.25 110 20 11 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A y 0 2.5 5 mm scale TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1 A max. 1.1 |
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