SL2S2002_SL2S2102_SDS

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© NXP B.V. 2011. All rights reserved.

Product short data sheet

PUBLIC

Rev. 3.2 — 10 January 2011

198332

7 of 13

NXP Semiconductors

SL2S2002; SL2S2102

ICODE SLIX

8.

Limiting values

[1]

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only

and functional operation of the device at these or any conditions other than those described in the operating conditions and electrical

characteristics sections of this specification is not implied.

[2]

This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static

charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.

[3]

[4]

For ESD measurement, the IC was mounted in a CDIP8 package.

Table 5.

Limiting values (Wafer)[1][2]

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

storage temperature

−55

+125

°C

total power dissipation

-

125

mW

junction temperature

−40

+85

°C

maximum input current

LA to LB; peak

[3] -

±60

mA

input current

LA to LB; RMS

-

30

mA

electrostatic discharge voltage

Human body model

[4] -

±2kV