AD8222BCPZ-R7 datasheet(22/24 Pages) AD

22 / 24 page

AD8222

Rev. A | Page 22 of 24

OUTLINE DIMENSIONS

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC.

0.65

BSC

0.60 MAX

PIN 1

INDICATOR

1.95 BCS

0.50

0.40

0.30

0.25 MIN

3.75

BSC SQ

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.30

0.23

0.18

0.05 MAX

0.02 NOM

0.20 REF

4.00

BSC SQ

2.65

2.50 SQ

2.35

EXPOSED

PAD

BOTTOM VIEW

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 54. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

(CP-16-13)

Dimensions are shown in millimeters

COMPLIANT

TO JEDEC STANDARDS MO-263-VBBC

3.75

BCS SQ

4.00

BSC SQ

0.65

BSC

0.75

0.60

0.50

TOP VIEW

12° MAX

0.80 MAX

0.65 TYP

SEATING

PLANE

PIN 1

INDICATOR

COPLANARITY

0.08

1.00

0.85

0.80

0.35

0.30

0.25

0.05 MAX

0.02 NOM

0.20 REF

BOTTOM VIEW

0.60 MAX

1.95 REF

Figure 55. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad, with Hidden Paddle

CP-16-19

Dimensions shown in millimeters

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