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AS5050 数据表(PDF) 19 Page - ams AG |
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AS5050 数据表(HTML) 19 Page - ams AG |
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19 / 22 page ![]() www.austriamicrosystems.com Revision 1.12 19 - 22 AS5050 Datasheet - Pack a ge Drawin gs and Ma r k ings 9 Package Drawings and Markings The device is available in a 16-pin QFN (4x4x0.85mm) package. Figure 17. Package Drawing and Hall Sensor Location Marking: YYWWXZZ. YY WW X ZZ Year (i.e. 04 for 2004) Week Assembly plant identifier Assembly traceability code Symbol Min Nom Max A 0.80 0.85 0.90 A1 0.00 0.05 b 0.25 0.30 0.35 D 4.00 BSC E 4.00 BSC D1 2.50 2.60 2.70 E1 2.50 2.60 2.70 Symbol Min Nom Max Notes e - 0.65 BSC - L 0.40 0.45 0.50 L1 0.10 Dx 1.85 2.00 2.15 1 Dy 1.85 2.00 2.15 2 Dz 0.323 0.383 0.443 3 r 1.00 4 BOTTOM VIEW Lb D1 Pin 1 indicator e e L L1 TOP VIEW D A A1 A1 /2 1 4 8 9 12 16 13 Hall sensor array center of die Dx Dz Notes: 1. Center of die to package edge 2. Center of die to package edge 3. Surface of die to package surface 4. Radius of Hall array YYWWXZZ AS5050 |
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