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TLRH30TP 数据表(PDF) 3 Page - Toshiba Semiconductor

部件名 TLRH30TP
功能描述  Panel Circuit Indicators
PDF  9 Pages
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制造商  TOSHIBA [Toshiba Semiconductor]
网页  http://www.semicon.toshiba.co.jp/eng
标志 TOSHIBA - Toshiba Semiconductor

TLRH30TP 数据表(HTML) 3 Page - Toshiba Semiconductor

  TLRH30TP Datasheet HTML 1Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 2Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 3Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 4Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 5Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 6Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 7Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 8Page - Toshiba Semiconductor TLRH30TP Datasheet HTML 9Page - Toshiba Semiconductor  
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TL(RH,RMH,SH,OH,YH)30TP(F)
2009-03-09
3
Electrical and Optical Characteristics (Ta = 25°C)
Emission Wavelength
Luminous Intensity
IV
Forward Voltage
VF
Reverse
Current
IR
λd
λP
Δλ
Product Name
Min
Typ.
Max
Typ.
Typ.
IF
Min
Typ.
IF
Typ.
Max
IF
Max
VR
TLRH30TP(F)
630
644
13
20
272
680
20
1.9
2.4
20
50
4
TLRMH30TP(F)
626
636
13
20
476
950
20
1.9
2.4
20
50
4
TLSH30TP(F)
613
623
13
20
476
1300
20
2.0
2.4
20
50
4
TLOH30TP(F)
605
612
13
20
476
1600
20
2.0
2.4
20
50
4
TLYH30P(F)
581
587
595
590
13
20
476
1350
20
2.0
2.4
20
50
4
Unit
nm
mA
mcd
mA
V
mA
μA
V
Precautions
Please be careful of the following:
• Soldering temperature: 260°C max, soldering time: 3 s max
(Soldering portion of lead: up to 1.6 mm from the body of the device)
• If the lead is formed, the lead should be formed up to 1.6 mm from the body of the device without forming stress
to the resin. Soldering should be performed after lead forming.
• This visible LED lamp also emits some IR light.
If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light.



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