DAC8562, DAC8563

DAC8162, DAC8163

DAC7562, DAC7563

SLAS719C

– AUGUST 2010 – REVISED JUNE 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

MAXIMUM

MAXIMUM

MAXIMUM

SPECIFIED

RELATIVE

DIFFERENTIAL

REFERENCE

RESET

PACKAGE-

PACKAGE

PACKAGE

PRODUCT

TEMPER-

ACCURACY

NONLINEARITY

DRIFT

TO

LEAD

DESIGNATOR

MARKING

ATURE RANGE

(LSB)

(LSB)

(ppm/

°C)

QFN-10

DSC

DAC8562

Zero

8562

MSOP-10

DGS

±12

±1

10

–40°C to 125°C

QFN-10

DSC

DAC8563

Mid-scale

8563

MSOP-10

DGS

QFN-10

DSC

DAC8162

Zero

8162

MSOP-10

DGS

±3

±0.5

10

–40°C to 125°C

QFN-10

DSC

DAC8163

Mid-scale

8163

MSOP-10

DGS

QFN-10

DSC

DAC7562

Zero

7562

MSOP-10

DGS

±0.75

±0.25

10

–40°C to 125°C

QFN-10

DSC

DAC7563

Mid-scale

7563

MSOP-10

DGS

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI

Web site at www.ti.com.

2

Copyright

© 2010–2011, Texas Instruments Incorporated