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For price, delivery and to place orders: Hittite Microwave Corporation, 2 Elizabeth Drive, Chelmsford, MA 01824

978-250-3343 tel • 978-250-3373 fax • Order On-line at www.hittite.com

Application Support: apps@hittite.com

HMC960LP4E

v00.0211

DC - 100 MHz DUAL DigitAL

VAriAbLe gAin AMpLifier with DriVer

Outline Drawing

Part Number

Package Body Material

Lead Finish

HMC960LP4E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

H960

XXXX

[1] 4-Digit lot number XXXX

[2] Max peak reflow temperature of 260 °C

package information

table 3. Absolute Maximum ratings

Nominal 5 V Supply to GND

VDDI, VDDQ, DVDD

-0.3 to 5.5 V

Common Mode Inputs Pins

(CMI, CMQ)

-0.3 to 5.5 V

Input and Output Pins

IIP, IIN, IQP, IQN, OIP, OIN, OQP,

OQN

-0.3 to 5.5 V

Digital Pins

SEN, SDI, SCK, SDO, GC[6:0]

SDO min load impedance

-0.3 to 5.5 V

1 kΩ

Operating Temperature Range

-40 to +85 °C

Storage Temperature

-65 to +125 °C

Maximum Junction Temperature

125 °C

Thermal Resistance (Rth)

(junction to ground paddle)

10 °C/W

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

Reflow Soldering

Peak Temperature

Time at Peak Temperature

260 °C

40 µs

ESD Sensitivity (HBM)

1 kV Class 1 C

Stresses above those listed under Absolute Maximum Ratings may

cause permanent damage to the device. This is a stress rating only;

functional operation of the device at these or any other conditions

above those indicated in the operational section of this specification

is not implied. Exposure to absolute maximum rating conditions for

extended periods may affect device reliability.

NOTES:

[1] PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED PLASTIC

SILICA AND SILICON IMPREGNATED.

[2] LEAD AND GROUND PADDLE MATERIAL: COPPER ALLOY.

[3] LEAD AND GROUND PADDLE PLATING: 100% MATTE TIN.

[4] DIMENSIONS ARE IN INCHES [MILLIMETERS].

[5] LEAD SPACING TOLERANCE IS NON-CUMULATIVE.

[6] PAD BURR LENGTH SHALL BE 0.15mm MAX. PAD BURR HEIGHT SHALL

BE 0.25m MAX.

[7] PACKAGE WARP SHALL NOT EXCEED 0.05mm

[8] ALL GROUND LEADS AND GROUND PADDLE MUST BE SOLDERED TO

PCB RF GROUND.

[9] REFER TO HITTITE APPLICATION NOTE FOR SUGGESTED PCB LAND

PATTERN.