40

MEMS Gauge Pressure Sensor

2SMPP

Precautions

■ Precautions for Correct Use

Handling

• Only air can be used as pressure media on the products directly. It

is prohibited to use pressure media including corrosive gases (e.g.

organic solvents gases, sulfur dioxide and hydrogen sulfide gases),

fluid and any other foreign materials.

• The products are not water proof. Please keep dry in use.

• Don't use the products under dew-condensing conditions. Frozen

fluid on sensor chips may also cause fluctuation of sensor output

and other troubles.

• Don't put foreign materials (e.g. a wire or pin) into connecting tube.

It may cause breakage of pressure sensor chips or fluctuation of

sensor output caused by clogging the tube.

• Use the products within rated pressure. Usage at pressure out of

the range may cause breakage.

• Don't use under high-frequency vibration including ultrasonic wave.

• The products may be broken by static electricity. Charged materials

(e.g. a workbench and a floor) and workers must provide measures

against static electricity, including ground connection.

• Overpowering terminals may deform them and detract their solder-

ability. Don't drop or handle the products roughly.

• Don't use the products under humid or dusty condition.

• Terminals connection of pressure sensors must be handled as

directed by a connection diagram.

Environmental Conditions for Transport and Storage

• It is prohibited to keep the products with corrosive gases (e.g.

organic solvents gases, sulfur dioxide and hydrogen sulfide gases).

• The products are not water proof. Please keep dry during storage.

• An anti-static treatment has been applied to the sleeves. Please

note the following points.

1. Getting wet may remove an anti-static treatment and elimi-

nate its effect.

2. The sleeves may feel sticky under hot and humid condition

due to the nature of the anti-static treatment.

3. Anti-static has aging degradation. It is prohibited to keep the

sleeves for more than six months. The sleeves are also non-

reusable.

• Don't keep the products under humid or dusty condition.

Mounting

• Use lands on the printed-circuit boards to which the sensor can be

securely fixed.

• Fix pin No.2 on the printed-circuit boards, not fixed causes fluctua-

tion of sensor output signals.

Soldering

• Due to its small size, the thermal capacity of the pressure sensor is

low. Therefore, take steps to minimize the effects of external heat.

• Dip soldering bath: Max.260

°C, within 10 sec.

• Soldering iron: Max. 260

°C, within 10 sec.

• Do not heat the case of sensor package, heat only terminal.

• Use a non-corrosive resin type of flux. Since the pressure sensor

chip is exposed to the atmosphere, do not allow flux to enter inside.

Cleaning

• Since the pressure sensor chip is exposed to atmosphere, do not

allow cleaning fluid to enter inside.

• Avoid ultrasonic cleaning since this may cause breaks or discon-

nections in the wiring.

Coating

• Do not coat the pressure sensor when it is mounted to the print cir-

cuit board.

• Do not wash the print circuit board after the pressure sensor is

mounted using detergent containing silicone. Otherwise, the deter-

gent may remain on the surface of the pressure sensor.