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ECMF02-2AMX6 数据表(PDF) 9 Page - STMicroelectronics |
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ECMF02-2AMX6 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 15 page ![]() ECMF02-2AMX6 Package information Doc ID 17815 Rev 2 9/15 4 Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Note: Product marking may be rotated by 90° for assembly plant differentiation. In no case should this product marking be used to orient the component for its placement on a PCB. Only pin 1 mark is to be used for this purpose. Table 3. µQFN-6L dimensions Ref. Dimensions Millimeters Inches Min. Typ. Max. Min. Typ. Max. A 0.45 0.50 0.55 0.018 0.020 0.022 A1 0.00 0.02 0.05 0.00 0.0008 0.0009 b 0.18 0.25 0.30 0.007 0.010 0.012 D 1.65 1.70 1.75 0.065 0.067 0.069 E 1.45 1.50 1.55 0.057 0.059 0.061 e 0.45 0.50 0.55 0.018 0.020 0.022 L 0.30 0.40 0.50 0.012 0.016 0.020 Figure 18. Footprint (dimensions in mm) Figure 19. Marking TOP VIEW SIDE VIEW D e b 0.25 1.25 KD |
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