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ECMF02-2AMX6 数据表(PDF) 11 Page - STMicroelectronics |
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ECMF02-2AMX6 数据表(HTML) 11 Page - STMicroelectronics |
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11 / 15 page ![]() ECMF02-2AMX6 Recommendation on PCB assembly Doc ID 17815 Rev 2 11/15 5 Recommendation on PCB assembly 5.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 21. Stencil opening dimensions b) General design rule Stencil thickness (T) = 75 ~ 125 µm 2. Reference design a) Stencil opening thickness: 100 µm b) Stencil opening for leads: Opening to footprint ratio is 90%. Figure 22. Recommended stencil window position L T W Aspect ratio W T ----- 1.5 ≥ = Aspect area LW × 2T L W + () ---------------------------- 0.66 ≥ = 236 µm 250µm 7 µm 15 µm Stencil window Footprint |
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