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FM3130-G 数据表(PDF) 21 Page - Ramtron International Corporation |
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FM3130-G 数据表(HTML) 21 Page - Ramtron International Corporation |
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21 / 22 page ![]() O BS O LE TE N o D ire ct R ep la ce m en t Al te rn at iv e: FM 31 64 FM3130 Integrated RTC/Alarm with 64Kb FRAM Rev. 3.2 Sept. 2011 Page 21 of 22 8-pin TDFN (3.0 mm x 6.4 mm body, 0.65mm pitch) Pin 1 3.00 ±0.1 0.75 ±0.05 0.25 ±0.05 0.65 0.20 REF. Pin 1 ID 0.0 - 0.05 Exposed metal pad. Do not connect to anything, except Vss. 6.70 0.30 0.65 Recommended PCB Footprint 0.40 ±0.1 0.60 3.10 1.10 1.00 ±0.10 1.95 REF Note: All dimensions in millimeters. This package is footprint compatible with the 8-pin TSSOP, however care must be taken to ensure PCB traces and vias are not placed within the exposed metal pad area. TDFN Package Marking Scheme for Body Size 3mm x 6.4mm Legend: R=Ramtron Int‟l Corp, G=”green” TDFN package XXXX=base part number LLLL= lot code YY=year, WW=work week Example: “Green” TDFN package, FM3130, Lot 0003, Year 2006, Work Week 33 RG 3130 0003 0633 RG XXXX LLLL YYWW |
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