IXD_602

12

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R02

5.4.3 Tape & Reel Information for SI and SIA Packages

5.4.4 PI (8-Pin DIP)

NOTES:

1. A

2. 10 pitches cumulative tol. ± 0.2mm

3. ( ) Reference dimensions only.

4. Unless otherwise specified, all dimensions in millimeters.

K

B

R0.50 TYP

8.00 ± 0.10

2.00 ± 0.10

4.00 ± 0.10 See Note #2

12.00 ± 0.30

5.50 ± 0.10

1.75 ± 0.10

∅1.50 (MIN)

∅1.55 ± 0.05

1.80 ± 0.10

(3.40)

0.30 ± 0.05

(70º)

A

(4.70)

(1.20)

A

A

B

B

SECTION A-A

SECTION B-B

Embossment

Embossed Carrier

Top Cover

Tape Thickness

0.102 MAX.

(0.004 MAX.)

330.2 DIA.

(13.00 DIA.)

Dimensions

mm MIN / mm MAX

(inches MIN / inches MAX)

NOTE: Molded package conforms to JEDEC standard configuration

MS-001 variation BA.

PC Board Pattern

7.62 / 10.92

(0.300 / 0.430)

7.62 BSC

(0.300 BSC)

0.20 / 0.38

(0.008 / 0.015)

7.37 / 8.26

(0.290 / 0.325)

0.38 / 0.58

(0.015 / 0.023)

1.14 / 1.65

(0.045 / 0.065)

0.38 / 1.02

(0.015 / 0.040)

3.05 / 3.81

(0.120 / 0.150)

3.43 / 4.70

(0.135 / 0.185)

3.18 / 3.81

(0.125 / 0.150)

8-0.900 DIA.

(8-0.035 DIA.)

7.50

(0.295)

2.540

(0.100)

9.02 / 10.16

(0.355 / 0.400)

6.10 / 6.86

(0.240 / 0.270)

2.540 BSC

(0.100 BSC)

1.40

(0.055)