| 数据搜索系统,热门电子元器件搜索 |
|
IXDF602PI 数据表(PDF) 13 Page - Clare, Inc. |
|
|
|||||||||||||||||||||||||||||
IXDF602PI 数据表(HTML) 13 Page - Clare, Inc. |
|
13 / 13 page ![]() IXD_602 R02 www.clare.com 13 5.4.5 D2 (8-Pin DFN) 5.4.6 Tape & Reel Information for D2 Package Dimensions mm MIN / mm MAX (inches MIN / inches MAX) 5.00 BSC (0.197 BSC) 4.00 BSC (0.158 BSC) 0.80 / 1.00 (0.031 / 0.039) 0.00 / 0.05 (0.000 / 0.002) 0.95 BSC (0.037 BSC) 0.76 / 0.81 (0.030 / 0.032) 0.30 / 0.45 (0.012 / 0.018) 3.04 / 3.09 (0.120 / 0.122) 2.54 / 2.59 (0.100 / 0.102) 0.35 / 0.45 x 45º (0.014 / 0.018 x 45º) Pin 1 Pin 1 Pin 8 0.20 REF (0.008 REF) Recommended PCB Land Pattern 4.50 (0.177) 0.45 (0.018) 1.20 (0.047) 3.05 (0.120) 2.55 (0.100) 0.95 (0.037) 0.35 x 45º (0.014 x 45º) NOTE: The exposed metal pad on the back of the D2 package may be left floating or connected to ground. It is not suitable for carrying current. K 0=1.90 ± 0.10 B 0=5.40 ± 0.10 5º MAX A 0=4.25 ± 0.10 5º MAX 0.30 ± 0.05 (0.05) (0.05) R0.75 TYP 8.00 ± 0.10 2.00 ± 0.05 4.00 ± 0.10 See Note #2 12.00 ± 0.30 5.50 ± 0.05 1.75 ± 0.10 ∅1.50 (MIN) ∅1.55 ± 0.05 NOTES: 1. A 0 & B0 measured at 0.3mm above base of pocket. 2. 10 pitches cumulative tol. ± 0.2mm 3. ( ) Reference dimensions only. 4. Unless otherwise specified, all dimensions in millimeters. Embossment Embossed Carrier Top Cover Tape Thickness 0.102 MAX. (0.004 MAX.) 330.2 DIA. (13.00 DIA.) For additional information please visit our website at: www.clare.com Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-IXD_602-R02 ©Copyright 2011, Clare, Inc. All rights reserved. Printed in USA. 2/3/2011 |
|
|
链接网址 |
| ALLDATASHEET是否为您带来帮助? [ DONATE ] |
关于 Alldatasheet | 广告服务 | 联系我们 | 隐私政策 | 数据表链接 | 链接交换 | 制造商名单 All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |