AD9739ABBCZ datasheet(63/64 Pages) AD

63 / 64 page

Data Sheet

AD9737A/AD9739A

Rev. C | Page 63 of 64

OUTLINE DIMENSIONS

12.10

12.00 SQ

11.90

0.43 MAX

0.25 MIN

1.00 MAX

0.85 MIN

1.40 MAX

0.55

0.50

0.45

10.40

BSC SQ

COMPLIANT WITH JEDEC STANDARDS MO-275-GGAA-1.

COPLANARITY

0.12

BALL DIAMETER

0.80

BSC

DETAIL A

A1 BALL

CORNER

A1 BALL

CORNER

DETAIL A

BOTTOM VIEW

TOP VIEW

SEATING

PLANE

Figure 189. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

(BC-160-1)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature Range

Package Description

Package Option

AD9737ABBCZ

−40°C to +85°C

160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-160-1

AD9737ABBCZRL

−40°C to +85°C

160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-160-1

AD9737A-EBZ

Evaluation Board for Normal, CMTS, and Mix-Mode Evaluation

AD9739ABBCZ

−40°C to +85°C

160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-160-1

AD9739ABBCZRL

−40°C to +85°C

160- Ball Chip Scale Package Ball Grid Array [CSP_BGA]

BC-160-1

AD9739A-EBZ

Evaluation Board for Normal, CMTS, and Mix-Mode Evaluation

AD9739A-FMC-EBZ

Evaluation Board with FMC connector for Xilinx based FPGA

development platforms

1 Z = RoHS Compliant Part.

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