ADP223ACPZ-R7 datasheet(5/24 Pages) AD

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Data Sheet

ADP222/ADP223/ADP224/ADP225

Rev. B | Page 5 of 24

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

VIN to GND

−0.3 V to +6 V

ADJ1, ADJ2, VOUT1, VOUT2 to GND

−0.3 V to VIN

EN1, EN2 to GND

−0.3 V to +6 V

Storage Temperature Range

−65°C to +150°C

Operating Junction Temperature Range

−40°C to +125°C

Soldering Conditions

JEDEC J-STD-020

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL DATA

Absolute maximum ratings apply individually only, not in

combination.

The ADP222/ADP223/ADP224/ADP225 can be damaged when

the junction temperature limits are exceeded. Monitoring

ambient temperature does not guarantee that TJ is within the

specified temperature limits. In applications with high power

dissipation and poor thermal resistance, the maximum ambient

temperature may have to be derated. In applications with

moderate power dissipation and low PCB thermal resistance, the

maximum ambient temperature can exceed the maximum limit as

long as the junction temperature is within specification limits.

The junction temperature (TJ) of the device is dependent on the

ambient temperature (TA), the power dissipation of the device

(PD), and the junction-to-ambient thermal resistance of the

package (θJA). Maximum junction temperature (TJ) is calculated

from the ambient temperature (TA) and power dissipation (PD)

using the formula

TJ = TA + (PD × θJA)

Junction-to-ambient thermal resistance (θJA) of the package is

based on modeling and calculation using a 4-layer board. θJA

is highly dependent on the application and board layout. In

applications where high maximum power dissipation exists,

close attention to thermal board design is required. The value

of θJA may vary, depending on PCB material, layout, and

environmental conditions. The specified value of θJA is based

on a 4-layer, 4 in × 3 in, 2½ oz copper board, as per JEDEC

standards. For more information, see the AN-772 Application

Note, A Design and Manufacturing Guide for the Lead Frame

Chip Scale Package (LFCSP).

ΨJB is the junction-to-board thermal characterization parameter

with units of °C/W. ΨJB of the package is based on modeling and

calculation using a 4-layer board. The JESD51-12, Guidelines for

Reporting and Using Package Thermal Information, states that

thermal characterization parameters are not the same as thermal

resistances. ΨJB measures the component power flowing

through multiple thermal paths rather than a single path as in

thermal resistance, θJB. Therefore, ΨJB thermal paths include

convection from the top of the package as well as radiation from

the package, factors that make ΨJB more useful in real-world

applications. Maximum junction temperature (TJ) is calculated

from the board temperature (TB) and power dissipation (PD)

using the formula

TJ = TB + (PD × ΨJB)

Refer to JESD51-8 and JESD51-12 for more detailed

information about ΨJB.

THERMAL RESISTANCE

θJA and ΨJB are specified for the worst-case conditions, that is, a

device soldered in a circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

θJA

θJC

ΨJB

Unit

8-Lead 2 mm × 2 mm LFCSP

50.2

31.7

18.2

°C/W

ESD CAUTION

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