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ADP5024ACPZ-R7 数据表(PDF) 2 Page - Analog Devices

部件名 ADP5024ACPZ-R7
功能描述  Dual 3 MHz, 1200 mA Buck
PDF  28 Pages
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制造商  AD [Analog Devices]
网页  http://www.analog.com
标志 AD - Analog Devices

ADP5024ACPZ-R7 数据表(HTML) 2 Page - Analog Devices

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ADP5024
Data Sheet
Rev. A | Page 2 of 28
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Typical Application Circuit ............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
General Specifications ................................................................. 3
BUCK1 and BUCK2 Specifications ........................................... 4
LDO Specifications ...................................................................... 5
Input and Output Capacitor, Recommended Specifications.. 6
Absolute Maximum Ratings............................................................ 7
Thermal Resistance ...................................................................... 7
ESD Caution.................................................................................. 7
Pin Configuration and Function Descriptions............................. 8
Typical Performance Characteristics ............................................. 9
Theory of Operation ...................................................................... 16
Power Management Unit........................................................... 17
BUCK1 and BUCK2 .................................................................. 19
LDO.............................................................................................. 20
Applications Information .............................................................. 21
Buck External Component Selection....................................... 21
LDO External Component Selection....................................... 23
Power Dissipation and Thermal Considerations ....................... 24
Buck Regulator Power Dissipation .......................................... 24
Junction Temperature ................................................................ 25
PCB Layout Guidelines.................................................................. 26
Typical Application Schematics.................................................... 27
Bill of Materials........................................................................... 27
Outline Dimensions....................................................................... 28
Ordering Guide .......................................................................... 28
REVISION HISTORY
1/1 —Rev. 0 to Rev. A
Changes to Features Section and Figure 1..................................... 1
Changes to Table 2............................................................................ 4
Changes to Table 3............................................................................ 5
Changes to Table 4............................................................................ 6
Changes to Table 7............................................................................ 8
Changes to Figure 34...................................................................... 14
Changes to LDO Section and Figure 48 ...................................... 20
Changes to Table 9 and Figure 50................................................. 22
Changes to Buck Regulator Power Dissipation Section ............ 24
Changes to Figure 52 and Figure 53............................................. 27
Changes to Ordering Guide .......................................................... 28
8/11—Revision 0: Initial Version



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