ADV7619

Data Sheet

Rev. B | Page 8 of 24

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

Rating

DVDD to GND

2.2 V

PVDD to GND

2.2 V

DVDDIO to GND

4.0 V

CVDD to GND

2.2 V

TVDD to GND

4.0 V

Digital Inputs to GND

GND − 0.3 V to DVDDIO + 0.3 V

5 V Tolerant Digital Inputs

to GND1

5.3 V

Digital Outputs to GND

GND − 0.3 V to DVDDIO + 0.3 V

XTALP, XTALN

−0.3 V to PVDD + 0.3 V

SCL, SDA Data Pins to

DVDDIO

DVDDIO − 0.3 V to DVDDIO + 3.6 V

Maximum Junction

125°C

Storage Temperature Range

−60°C to +150°C

Infrared Reflow Soldering

(20 sec)

260°

1

The following inputs are 3.3 V inputs but are 5 V tolerant: DDCA_SCL,

DDCA_SDA, DDCB_SCL, and DDCB_SDA.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

PACKAGE THERMAL PERFORMANCE

To reduce power consumption when using the ADV7619, the

user is advised to turn off the unused sections of the part.

Due to PCB metal variation and, therefore, variation in PCB

The most efficient measurement solution is obtained using the

package surface temperature to estimate the die temperature

because this solution eliminates the variance associated with

be exceeded. The following equation calculates the junction

temperature using the measured package surface temperature

and applies only when no heat sink is used on the device under

test (DUT):

where:

where 0.2 is 20% of the TVDD power that is dissipated on the

part itself.

ESD CAUTION