ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS

Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application.

These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave

soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming

Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.

AP02001 Rev. 52

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Suggested Pad Layout

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MSOP8-EP

MSOP-10

Dimensions

Value

(in mm)

C

0.650

G

0.450

X

0.450

X1

2.000

Y

1.350

Y1

1.700

Y2

5.300

Dimensions

Value

(in mm)

X

0.30

Y

1.4

C1

4.4

C2

0.50

POWERDI

POWERDI

Dimensions

Value (in mm)

C

1.840

G

0.852

X

3.360

X1

1.390

Y

4.860

Y1

1.400

G

1.0

0.5

X1

2.2

2.0

X2

0.9

0.8

Y1

1.4

0.8

Y2

1.4

1.1

POWERDI

Dimensions

Value

(in mm)

G

2.000

X

1.050

X1

4.100

Y

1.500

G

X

C

Y

Y2

Y1

X1

X

Y

C1

C2

G

X

C

Y1

(2x)

Y

X1

(2x)

X1

GX2

Y2

Y1

X

Y

X1

G