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AP02001 数据表(PDF) 14 Page - Diodes Incorporated |
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AP02001 数据表(HTML) 14 Page - Diodes Incorporated |
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14 / 27 page ![]() ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 52 14 of 27 www.diodes.com Suggested Pad Layout © Diodes Incorporated POWERDI ®3333-8 POWERDI ®3333-8 Type B Dimensions Value (in mm) C 0.650 G 0.230 G1 0.420 Y 3.700 Y1 2.250 Y2 1.850 Y3 0.700 X 2.370 X2 0.420 Dimensions Value (in mm) C 0.650 G 0.230 X 0.420 X1 2.370 X2 0.420 X3 1.890 X4 2.710 Y 0.700 Y1 0.400 Y2 1.160 Y3 1.850 Y4 0.405 Y5 1.295 Y6 3.700 X Y Y1 Y3 Y2 X2 C 14 85 G G1 X1 Y6 Y2 Y (5x) Y3 X (5x) C G X2 (3x) X3 Y5 X4 Y4 Y1 |
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