ABSOLUTE MAXIMUM RATINGS

(1)

THS6204

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

PACKAGE-LEAD

DESIGNATOR

PACKAGE MARKING

TRANSPORT MEDIA, QUANTITY

THS6204IRHFT

Tape and Reel, 250

QFN-24

RHF

6204

THS6204IRHFR

Tape and Reel, 3000

THS6204IPWP

Rails, 60

TSSOP-24

PWP

THS6204

THS6204IPWPR

Tape and Reel, 2000

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

The PowerPAD is electrically isolated from all other pins.

Over operating free-air temperature range, unless otherwise noted.

THS6204

UNIT

28

V

±2

V

(2)

±100

mA

Continuous power dissipation

See Dissipation Ratings table

(3)

+150

°C

+130

°C

package

+140

°C

package

–65 to +150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

+300

°C

Human body model (HBM)

2000

V

ESD ratings

Charged device model (CDM)

500

V

Machine model (MM)

100

V

(1)

Stresses above those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may degrade device reliability.

(2)

The THS6204 incorporates a PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally

dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature which could

permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD

thermally-enhanced package. Under high-frequency ac operation (> 10kHz), the short-term output current capability is much greater

than the continuous dc output current rating. This short-term output current rating is about 8.5X the dc capability, or about ±850mA.

(3)

The absolute maximum junction temperature under any condition is limited by the constraints of the silicon process.

(4)

The absolute maximum junction temperature for continuous operation is limited by the package constraints. Operation above this

temperature may result in reduced reliability and/or lifetime of the device.

2

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