Analog Integrated Circuit Device Data



8

Freescale Semiconductor

33663

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Thermal Ratings

Operating Temperature

Ambient

Junction

-40 to 125

-40 to 150

C

Storage Temperature

-40 to 150

C

150

°C/W

Peak package reflow temperature during reflow(4),(5)

Note 5

Thermal Shutdown Temperature

150 to 200

°C

Thermal Shutdown Hysteresis Temperature

20

°C

Notes

4.

Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

5.

Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

Table 4. Limits / Maximum test voltage for transient immunity tests

Test Pulse

Pulse repetition

Test duration [min]

Remarks

1

-100

2

1 for function test

10 for damage test

10

2a

+75

2

2

3a

-150

10

50

3b

+100

10

50

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

VSUP

Transient Pulse

Generator

(Note)

GND

DUT

DUT GND

D1

10 µF