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MCP2021 数据表(PDF) 34 Page - Microchip Technology |
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MCP2021 数据表(HTML) 34 Page - Microchip Technology |
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34 / 52 page ![]() MCP2021/2/1P/2P DS22018F-page 34 © 2005-2012 Microchip Technology Inc. 3.1 Package Marking Information (Continued) MCP2022 MCP2022P MCP2022-500 2022P-500 MCP2022 MCP2022P MCP2022-500 MCP2022P-500 8-Lead SOIC (3.90 mm) Example NNN MCP2021 MCP2021P 2021500E 2021P50E 2021500E SN 1033 256 3 14-Lead PDIP (300 mil) Example 14-Lead SOIC (3.90 mm) Example Legend: XX...X Customer-specific information Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( ) can be found on the outer packaging for this package. Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e MCP2022-500 E/P 1033256 3 MCP2022-500 E/SL 1033256 3 |
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