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STA369BWS 数据表(PDF) 85 Page - STMicroelectronics |
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STA369BWS 数据表(HTML) 85 Page - STMicroelectronics |
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85 / 89 page ![]() STA369BWS Package thermal characteristics Doc ID 16861 Rev 4 85/89 8 Package thermal characteristics Using a double-layer PCB the thermal resistance, junction to ambient, with 2 copper ground areas of 3 x 3 cm2 and with 16 via holes is 24 °C/W in natural air convection. The dissipated power within the device depends primarily on the supply voltage, load impedance and output modulation level. Thus, the maximum estimated dissipated power for the STA369BWS is: Figure 29 shows the power derating curve for the PowerSSO-36 package on PCBs with copper areas of 2 x 2 cm2 and 3 x 3 cm2. Figure 29. PowerSSO-36 power derating curve 2 x 20 W @ 8 Ω, 18 V Pd max is approximately 4 W 2 x 9 W + 1 x 20 W @ 4 Ω, 8 Ω, 18 V Pd max is approximately 5 W 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 Pd (W) Tamb ( °C) Copper Area 2x2 cm and via holes STA339BW PSSO36 Copper Area 3x3 cm and via holes 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8 0 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 0 1 2 3 4 5 6 7 8 0 20 40 60 80 100 120 140 160 Pd (W) Tamb ( °C) Copper Area 2x2 cm and via holes STA339BW PSSO36 Copper Area 3x3 cm and via holes STA369BWS PowerSSO-36 |
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