STPS30170DJF datasheet(4/7 Pages) STMICROELECTRONICS

4 / 7 page

Characteristics

STPS30170DJF

4/7

Doc ID 16749 Rev 3

Figure 7.

Reverse leakage current versus

reverse voltage applied

(typical values)

Figure 8.

Junction capacitance versus

reverse voltage applied

(typical values)

1.E-04

1.E-03

1.E-02

1.E-01

1.E+00

1.E+01

1.E+02

100

120

140

160

180

I (mA)

V (V)

T = 25 °C

T = 50 °C

T = 75 °C

T = 125 °C

T = 150 °C

T = 100 °C

100

1000

100

1000

C(pF)

F = 1 MHz

= 30 mV

T = 25 °C

osc

RMS

V (V)

Figure 9.

Forward voltage drop versus

forward current

Figure 10.

Thermal resistance, junction to

ambient, versus copper surface

under tab

0.0

0.1

0.2

0.3

0.4

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

T = 125 °C

(Maximum values)

T = 125 °C

(Typical values)

T = 25 °C

(Maximum values)

I (A)

V (V)

100

150

200

250

678

(°C/W)

th(j-a)

epoxy printed board Fr4,

copper thickness=35 µm

S (cm²)

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