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LPS331AP 数据表(PDF) 9 Page - STMicroelectronics |
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LPS331AP 数据表(HTML) 9 Page - STMicroelectronics |
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9 / 36 page ![]() LPS331AP Application hints Doc ID 022112 Rev 7 9/36 4 Application hints Figure 3. LPS331AP electrical connection The device core is supplied through the Vdd line. Power supply decoupling capacitors (100 nF ceramic, 10 µF aluminum) should be placed as near as possible to the supply pad of the device (common design practice). The functionality of the device and the measured data outputs are selectable and accessible through the I2C/SPI interface. When using the I2C, CS must be tied high (i.e. connected to Vdd_IO). 4.1 Soldering information The HCLGA package is compliant with the ECOPACK® standard and it is qualified for soldering heat resistance according to JEDEC J-STD-020. 10¬µ Vdd 100nF GND Vdd_IO Res Digital signal from/to signal controller. Signal levels are defined through proper selection of Vdd_ 1 5 8 13 TOP VIEW 6 9 14 16 9 5 Res |
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