11 (14)

DA6180B.002

5 May, 2011

PACKAGE (TSSOP-16) OUTLINES

Dimension

Min

Max

Unit

A

6.40 BSC

mm

B

4.30

4.50

mm

C

5.00 BSC

mm

D

0.05

0.15

mm

E

1.10

mm

F

0.19

0.30

mm

G

0.65 BSC

mm

H

0.18

0.28

mm

I

0.09

0.20

mm

I1

0.09

0.16

mm

J

0.19

0.30

mm

J1

0.19

0.25

mm

K

0°

8°

L

0.24

0.26

mm

M

(The length of a terminal for

soldering to a substrate)

0.50

0.75

mm

N

1.00 REF

mm

O

12°

P

12°

Dimensions do not include mold flash, protrusions, or gate burrs.

All dimensions are in accordance with JEDEC standard MO-153.

B

A

C

Pin 1

D

Seating Plane

E

H

G

F

B

B

Detail A

L

K

M

N

P

O

Detail A

I

I1

J

J1

Section B-B