ARA2000 datasheet(14/21 Pages) ANADIGICS

14 / 21 page

Data Sheet - Rev 2.3

04/2011

ARA2000

Data Sheet - Rev 2.3

03/2011

ApplicAtion infoRMAtion

transmit enable / disable

The ARA2000 includes two amplification stages that

each can be shut down through external control pins

Vg1 and Vg2 (pins 6 and 23, respectively.) By applying

a slightly positive bias of typically +1.0 Volts, the

amplifier is enabled. In order to disable the amplifier,

the control pin needs to be pulled to ground.

A practical way to implement the necessary control is

to use bias resistor networks similar to those shown

in the test circuit schematic (Figure 4.) Each network

includes a resistor shunted to ground that serves as

a pull-down to disable the amplifier when no control

voltage is applied. When a positive voltage is applied,

the network acts as a voltage divider that presents

the required +1.0 Volts to enable the amplifier. By

selecting different resistor values for the voltage

divider, the network can accommodate different control

voltage inputs.

The Vg1 and Vg2 pins may be connected together

directly, and controlled through a single resistor

network from a common control voltage.

Amplifier Bias Current

The Iset pins (7 and 22) set the bias current for the

amplification stages. Grounding these pins results

in the maximum possible current. By placing a

resistor from the pin to ground, the current can be

reduced. The recommended bias conditions use the

configuration shown in the test circuit schematic in

Figure 4.

thermal layout considerations

The device package for the ARA2000 features a heat

slug on the bottom of the package body. Use of the

heat slug is an integral part of the device design.

Soldering this slug to the ground plane of the PC board

will ensure the lowest possible thermal resistance for

the device, and will result in the longest MTF (mean

time to failure.)

A PC board layout that optimizes the benefits of the

heat slug is shown in Figure 18. The via holes located

under the body of the device must be plated through

to a ground plane layer of metal, in order to provide a

sufficient heat sink. The recommended solder mask

outline is shown in Figure 19.

figure 18: pc Board layout

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