MCP2210 BREAKOUT MODULE

USER’S GUIDE

© 2012 Microchip Technology Inc.

DS52056A-page 25

Appendix B. Bill of Materials

TABLE B-1:

BILL OF MATERIALS

Qty

Designator

Description_

Manufacturer 1

Part Number

1

C1

Cap. Cerm. 22 uF 10V 20% Y5V 1206

C3216Y5V1A226Z

3

C2, C4, C5

Cap. Cerm .1 uF 10% 16V X7R 0603

AVX Corporation

0603YC104KAT2A

1

C3

Cap. Cerm. 4.7 uF 6.3V 10% X5R 0603

TDK Corporation

C1608X5R0J475K

1

C6

Cap. Cerm. 1 uF 16V 10% X7R 0603

TDK Corporation

C1608X7R1C105K

2J1, J2

DO NOT POPULATE

Conn. Hdr. Male .100 1x7 Pos. Vertical

HDR M 1x7 Vertical

1J3

DO NOT POPULATE

Conn. Hdr. Male .100 1x6 Pos. Vertical

Tyco Electronics

HDR M 1x6 Vertical

1J4

DO NOT POPULATE

Conn. Hdr. Male .100 1x3 Pos. Vertical

Tyco Electronics

HDR M 1x3 Vertical

1

J5

Conn. Rcpt. USB Mini B R/A SMD

Hirose Electric Co. Ltd.

UX60SC-MB-5ST(80)

1

R1

Res. 390 Ohm 1/10W 5% 0603 SMD

ERJ-3GEYJ391V

1

U1

IC USB-TO-SPI SSOP-20

Microchip Technology

Inc.

MCP2210-I/SS

1

U2

IC LDO Reg. 500 mA 3.3V SOT-223-3

Microchip Technology

Inc.

MCP1825S-3302E/DB

1

X1

Cer. Resonator 12.0 MHz SMD

CSTCE12M0G55-R0

Note 1:

The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.