MCP2210 BREAKOUT MODULE

USER’S GUIDE

© 2012 Microchip Technology Inc.

DS52056A-page 3

Table of Contents

Preface ........................................................................................................................... 5

Introduction............................................................................................................ 5

Document Layout .................................................................................................. 5

Conventions Used in this Guide ............................................................................ 6

Recommended Reading........................................................................................ 7

The Microchip Web Site ........................................................................................ 7

Customer Support ................................................................................................. 7

Document Revision History ................................................................................... 7

Chapter 1. Product Overview

1.1 Introduction ..................................................................................................... 9

1.2 MCP2210 Breakout Module General Description .......................................... 9

1.3 What the MCP2210 Breakout Module Kit Includes ........................................ 9

Chapter 2. Installation and Operation

2.1 Introduction ................................................................................................... 11

2.2 Board Setup ................................................................................................. 11

2.3 Board Operation ........................................................................................... 12

2.4 MCP2210 Typical Usage Scenarios ............................................................. 14

Appendix A. Schematic and Layouts

A.1 Introduction .................................................................................................. 17

A.2 Board – Schematic ....................................................................................... 18

A.3 Board – Top Silk and Pads .......................................................................... 19

A.4 Board – Top Silk, Pads and Copper ............................................................ 20

A.5 Board – Top Pads and Copper .................................................................... 21

A.6 Board – Bottom Silk and Pads ..................................................................... 22

A.7 Board – Bottom Silk, Pads and Copper ....................................................... 23

A.8 Board – Bottom Pads and Copper ............................................................... 24

Appendix B. Bill of Materials

Worldwide Sales and Service .................................................................................... 26