ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

±18 V

Internal Power Dissipation

Output Short Circuit Duration . . . . Observe Derating Curves

Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . . .

±V

S

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .

±6 V

Storage Temperature Range

Plastic DIP . . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +125°C

Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . –65

°C to +150°C

Small Outline IC . . . . . . . . . . . . . . . . . . . –65

°C to +125°C

Operating Temperature Range

AD810A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40

°C to +85°C

AD810S . . . . . . . . . . . . . . . . . . . . . . . . . . –55

°C to +125°C

Lead Temperature Range (Soldering 60 sec) . . . . . . . +300

°C

NOTES

permanent damage to the device. This is a stress rating only and functional

operation of the device at these or any other conditions above those indicated in the

operational section of this specification is not implied. Exposure to absolute

maximum raring conditions for extended periods may affect device reliability.

θ

8-Pin SOIC Package:

θ

ESD SUSCEPTIBILITY

ESD (electrostatic discharge) sensitive device. Electrostatic

charges as high as 4000 volts, which readily accumulate on the

human body and on test equipment, can discharge without

detection. Although the AD810 features ESD protection

circuitry, permanent damage may still occur on these devices if

they are subjected to high energy electrostatic discharges.

Therefore, proper ESD precautions are recommended to avoid

any performance degradation or loss of functionality.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

AD810AN

–40

°C to +85°C 8-Pin Plastic DIP

N-8

AD810AR

–40

°C to +85°C 8-Pin Plastic SOIC R-8

AD810AR-REEL

–40

°C to +85°C 8-Pin Plastic SOIC R-8

5962-9313201MPA –55

°C to +125°C 8-Pin Cerdip

Q-8

AD810A

AD810S

1

Parameter

Conditions

Min

Typ

Max

Min

Typ

Max

Units

Turn On Time

5

170

170

ns

Turn Off Time

100

100

ns

Disable Pin Current

Disable Pin = 0 V

±5 V

5075

5075

µA

±15 V

290

400

290

400

µA

Min Disable Pin Current to

Disable

±5 V, ±15 V

30

30

µA

POWER SUPPLY

Operating Range

+25

°C to T

MAX

±2.5

±18

±2.5

±18

V

±3.0

±18

±3.5

±18

V

Quiescent Current

±5 V

6.7

7.5

6.7

7.5

mA

±15 V

6.8

8.0

6.8

8.0

mA

±5 V, ±15 V

8.3

10.0

9

11.0

mA

Power-Down Current

±5 V

1.8

2.3

1.8

2.3

mA

±15 V

2.1

2.8

2.1

2.8

mA

NOTES

±5 V supplies using complementary output CMOS to drive the disable pin.

Specifications subject to change without notice.

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD810 is limited by the associated rise in junction temperature.

For the plastic packages, the maximum safe junction tempera-

ture is 145

°C. For the cerdip package, the maximum junction

temperature is 175

°C. If these maximums are exceeded momen-

tarily, proper circuit operation will be restored as soon as the die

temperature is reduced. Leaving the device in the “overheated”

condition for an extended period can result in device burnout.

To ensure proper operation, it is important to observe the

derating curves.

2.4

0.4

140

1.0

0.6

–40

0.8

–60

1.6

1.2

1.4

1.8

2.0

2.2

120

100

80

60

40

20

0

–20

8-PIN

MINI-DIP

AMBIENT TEMPERATURE –

8-PIN

SOIC

8-PIN

CERDIP

8-PIN

MINI-DIP

Maximum Power Dissipation vs. Temperature

While the AD810 is internally short circuit protected, this may

not be sufficient to guarantee that the maximum junction

temperature is not exceeded under all conditions.

1

5

2

3

0.1µF

6

AD810

0.1µF

10k

Ω

SEE TEXT

7

4

Offset Null Configuration

AD810

REV. A

–3–