REV. B

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use, nor for any infringements of patents or other rights of third parties

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a

AD9070

One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.

Tel: 781/329-4700

World Wide Web Site: http://www.analog.com

Fax: 781/326-8703

© Analog Devices, Inc., 2000

10-Bit, 100 MSPS

A/D Converter

FUNCTIONAL BLOCK DIAGRAM

T/H

DAC

ADC

VREF

IN

–2.5V

VREF

OUT COMP

REF

BYPASS

SOIC (BR)

PACKAGE

ONLY

ADC

SUM

AMP

TIMING

AIN

ENCODE

ENCODE

AIN

AD9070

ENCODE

LOGIC

D9 – D0

DIP

PACKAGE

ONLY

OR

10

GND

FEATURES

10-Bit, 100 MSPS ADC

Low Power: 600 mW Typical at 100 MSPS

On-Chip Track/Hold

230 MHz Analog Bandwidth

SINAD = 54 dB @ 41 MHz

On–Chip Reference

1 V p-p Analog Input Range

Single Supply Operation: +5 V or –5 V

Differential Clock Input

Available in Standard Military Drawing Version

APPLICATIONS

Digital Communications

Signal Intelligence

Digital Oscilloscopes

Spectrum Analyzers

Medical Imaging

Radar

HDTV

GENERAL DESCRIPTION

The AD9070 is a monolithic sampling analog-to-digital

converter with an on-chip track-and-hold circuit and ECL

digital interfaces. The product operates at a 100 MSPS

conversion rate with outstanding dynamic performance over

its full operating range.

The ADC requires only a single –5 V supply and an encode

clock for full performance operation. The digital outputs are

ECL compatible, while a differential clock input accommodates

a wide range of logic levels. The AD9070 may be operated in a

Positive ECL (PECL) environment with a single +5 V supply.

An Out-of-Range output (OR) is available in the DIP version to

indicate that a conversion result is outside the operating range.

In both package styles, the output data are held at saturation

levels during an out-of-range condition.

The input amplifier supports single-ended interfaces. An

internal –2.5 V reference is included in the SOIC packaged

device (an external voltage reference is required for the DIP

version).

Fabricated on an advanced bipolar process, the AD9070

is available in a plastic SOIC package specified over the

industrial temperature range (–40

°C to +85°C), and a full

MIL-PRF-38534 QML version (–55

°C to +125°C) in a

ceramic Dual-in-Line Package (DIP).