AD9708

–4–

REV. B

ABSOLUTE MAXIMUM RATINGS*

With

Parameter

Respect to

Min

Max

Units

AVDD

ACOM

–0.3

+6.5

V

DVDD

DCOM

–0.3

+6.5

V

ACOM

DCOM

–0.3

+0.3

V

AVDD

DVDD

–6.5

+6.5

V

CLOCK, SLEEP

DCOM

–0.3

DVDD + 0.3

V

Digital Inputs

DCOM

–0.3

DVDD + 0.3

V

IOUTA, IOUTB

ACOM

–1.0

AVDD + 0.3

V

COMP1, COMP2

ACOM

–0.3

AVDD + 0.3

V

REFIO, FSADJ

ACOM

–0.3

AVDD + 0.3

V

REFLO

ACOM

–0.3

+0.3

V

Junction Temperature

+150

°C

Storage Temperature

–65

+150

°C

Lead Temperature

(10 sec)

+300

°C

*Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to absolute maximum

ratings for extended periods may effect device reliability.

THERMAL CHARACTERISTICS

Thermal Resistance

28-Lead 300 mil SOIC

θ

°C/W

θ

°C/W

28-Lead TSSOP

θ

°C/W

θ

°C/W

PIN CONFIGURATION

14

13

12

11

17

16

15

20

19

18

10

9

8

1

2

3

4

7

6

5

TOP VIEW

(Not to Scale)

28

27

26

25

24

23

22

21

AD9708

NC = NO CONNECT

(MSB) DB7

DB6

DB5

DB4

DB3

DB2

DB1

DB0

NC

NC

NC

NC

NC

NC

CLOCK

DVDD

DCOM

NC

AVDD

COMP2

IOUTA

IOUTB

ACOM

COMP1

FS ADJ

REFIO

REFLO

SLEEP

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD9708 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

PIN FUNCTION DESCRIPTIONS

Pin No.

Name

Description

1

DB7

Most Significant Data Bit (MSB).

2–7

DB6–DB1

Data Bits 1–6.

8

DB0

Least Significant Data Bit (LSB).

9–14, 25 NC

No Internal Connection.

15

SLEEP

Power-Down Control Input. Active

High. Contains active pull-down circuit,

thus may be left unterminated if not

used.

16

REFLO

Reference Ground when Internal 1.2 V

Reference Used. Connect to AVDD to

disable internal reference.

17

REFIO

Reference Input/Output. Serves as

reference input when internal reference

disabled (i.e., Tie REFLO to AVDD).

Serves as 1.2 V reference output when

internal reference activated (i.e., Tie

REFLO to ACOM). Requires 0.1

µF

capacitor to ACOM when internal

reference activated.

18

FS ADJ

Full-Scale Current Output Adjust.

19

COMP1

Bandwidth/Noise Reduction Node.

Add 0.1

µF to AVDD for optimum

performance.

20

ACOM

Analog Common.

21

IOUTB

Complementary DAC Current Output.

Full-scale current when all data bits

are 0s.

22

IOUTA

DAC Current Output. Full-scale

current when all data bits are 1s.

23

COMP2

Internal Bias Node for Switch Driver

Circuitry. Decouple to ACOM with

0.1

µF capacitor.

24

AVDD

Analog Supply Voltage (+2.7 V to

+5.5 V).

26

DCOM

Digital Common.

27

DVDD

Digital Supply Voltage (+2.7 V to

+5.5 V).

28

CLOCK

Clock Input. Data latched on positive

edge of clock.

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Descriptions

Options*

AD9708AR

–40

°C to +85°C 28-Lead 300 Mil SOIC R-28

AD9708ARU –40

°C to +85°C 28-Lead TSSOP

RU-28

AD9708-EB

Evaluation Board

*R = Small Outline IC; RU = Thin Small Outline IC.

WARNING!

ESD SENSITIVE DEVICE