REV. 0

–8–

ADP3342

Current and thermal limit protections are intended to protect the

device against accidental overload conditions. For normal operation,

device power dissipation should be limited by operating conditions

so that junction temperatures will not exceed 150

°C.

Calculating Junction Temperature

Device power dissipation is calculated as follows:

PV

V

I

V

I

D

IN

OUT

LOAD

IN

GND

=+

(

–

)(

)

OUTLINE DIMENSIONS

Dimensions shown in inches and (mm).

8-Lead Micro SOIC (MSOP)

(RM-8)

0.011 (0.28)

0.003 (0.08)

0.028 (0.71)

0.016 (0.41)

33

27

0.120 (3.05)

0.112 (2.84)

85

4

1

0.122 (3.10)

0.114 (2.90)

0.199 (5.05)

0.187 (4.75)

PIN 1

0.0256 (0.65) BSC

0.122 (3.10)

0.114 (2.90)

SEATING

PLANE

0.006 (0.15)

0.002 (0.05)

0.018 (0.46)

0.008 (0.20)

0.043 (1.09)

0.037 (0.94)

0.120 (3.05)

0.112 (2.84)

CONTROLLING DIMENSIONS ARE IN MILLIMETERS. INCH DIMENSIONS

ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE

ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.

P

+

=

(.

. )

(. )

18

12 300

18 4

187

mA

mA

mW

The proprietary package used in the ADP3342 has a thermal

resistance of 110

°C/W, significantly lower than a standard

MSOP-8 package. Assuming a 4-layer board, the junction tem-

perature rise above ambient temperature will be approximately

equal to:

∆TW

C W

C

A

J

=×

°

=

°

0 187

110

20 6

..