RT8024 datasheet(5/13 Pages) RICHTEK

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RT8024

DS8024-02 March 2011

www.richtek.com

Parameter

Symbol

Test Conditions

Min

Typ

Max

Unit

FB Input Current

IFB

VFB = VIN

−50

VIN = 3.6V

0.3

PMOSFET RON

PRDS(ON) IOUT = 200mA

VIN = 2.5V

0.4

VIN = 3.6V

0.25

NMOSFET RON

NRDS(ON) IOUT = 200mA

VIN = 2.5V

0.35

P-Channel Current Limit

IP(LM)

VIN = 2.5V to 5.5 V

1.8

EN High-Level Input Voltage

VENH

VIN = 2.5V to 5.5V

1.5

EN Low-Level Input Voltage

VENL

VIN = 2.5V to 5.5V

0.4

Undervoltage Lock Out threshold

1.8

Hysteresis

0.1

Oscillator Frequency

fOSC

VIN = 3.6V, IOUT = 100mA

1.2

1.5

1.8

MHz

Thermal Shutdown Temperature

TSD

160

°C

Min. On Time

Max. Duty Cycle

100

LX Leakage Current

VIN = 3.6V, VLX = 0V or VLX = 3.6V

−1

μA

Note 1.

Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for

stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended

periods may remain possibility to affect device reliability.

Note 2.

θJA is measured in the natural convection at TA = 25°C on a low effective single layer thermal conductivity test board of

JEDEC 51-3 thermal measurement standard. Pin 2 of SOT-23-5/TSOT-23-5 packages is the case position for

θJC

measurement.

Note 3.

Devices are ESD sensitive. Handling precaution is recommended.

Note 4.

The device is not guaranteed to function outside its operating conditions.

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