TMP03/TMP04

REV. 0

–15–

EN

74HC4520 #2

Q0 Q1 Q2 Q3

Q0 Q1 Q2 Q3

7

15

9

8

16

2

3

4

56

11 12 13 14

EN

10

CLK

CLK

GND RESET RESET

1

+5V

+5V

V+

GND

TMP04

1

2

3

1

2

3

4

5

6

74HC08

+5V

LE

OUT

GND

74HC373

Q1 Q2 Q3 Q4

Q5 Q6 Q7 Q8

13 14 17 18

10

1

3

4

7

8

20

11

2

5

69

12 15 16 19

D1 D2 D3 D4

D5 D6 D7 D8

+5V

LE

OUT

GND

74HC373

Q1 Q2 Q3 Q4

Q5 Q6 Q7 Q8

13 14 17 18

10

1

3

4

7

8

20

11

2

5

69

12 15 16 19

D1 D2 D3 D4

D5 D6 D7 D8

+5V

LE

OUT

GND

74HC373

Q1 Q2 Q3 Q4

Q5 Q6 Q7 Q8

13 14 17 18

10

1

3

4

7

8

20

11

2

5

69

12 15 16 19

D1 D2 D3 D4

D5 D6 D7 D8

+5V

LE

OUT

GND

74HC373

Q1 Q2 Q3 Q4

Q5 Q6 Q7 Q8

13 14 17 18

10

1

3

4

7

8

20

11

2

5

69

12 15 16 19

D1 D2 D3 D4

D5 D6 D7 D8

+5V

GND

74HC4538

T2

T1

CLR

A

Q

B

13

14

10

8

11

16

6

9

12

15

20pF

NC

+5V

EN

74HC4520 #1

Q0 Q1 Q2 Q3

Q0 Q1 Q2 Q3

7

15

9

8

16

2

3

4

56

11 12 13 14

EN

10

CLK

CLK

GND RESET RESET

1

1MHZ

CLOCK

3.9k

Ω

+5V

Q

GND

74HC86

T2

T1

CLR

A

Q

B

3

2

6

8

5

7

4

1

20pF

NC

1k

Ω

+5V

Q

+5V

4

5

10k

Ω

10pF

10µF

0.1µF

T1 DATA (MICROSECONDS)

T2 DATA (MICROSECONDS)

Figure 36. A Hardware Interface for the TMP04

Monitoring Electronic Equipment

The TMP03/TMP04 are ideal for monitoring the thermal

environment within electronic equipment. For example, the

surface mounted package will accurately reflect the exact

thermal conditions which affect nearby integrated circuits. The

TO-92 package, on the other hand, can be mounted above the

surface of the board, to measure the temperature of the air

flowing over the board.

The TMP03 and TMP04 measure and convert the temperature

at the surface of their own semiconductor chip. When the

TMP03/TMP04 are used to measure the temperature of a

nearby heat source, the thermal impedance between the heat

source and the TMP03/TMP04 must be considered. Often, a

thermocouple or other temperature sensor is used to measure

the temperature of the source while the TMP03/TMP04

temperature is monitored by measuring T1 and T2. Once the

thermal impedance is determined, the temperature of the heat

source can be inferred from the TMP03/TMP04 output.

One example of using the TMP04 to monitor a high power

dissipation microprocessor or other IC is shown in Figure 37.

The TMP04, in a surface mount package, is mounted directly

beneath the microprocessor’s pin grid array (PGA) package. In

a typical application, the TMP04’s output would be connected

to an ASIC where the pulse width would be measured (see the

Hardware Interface section of this data sheet for a typical