TMP03/TMP04

REV. 0

–3–

WAFER TEST LIMITS

Parameter

Symbol

Conditions

Min

Typ

Max

Units

ACCURACY

Temperature Error

1

3.0

°C

Power Supply Rejection Ratio

PSRR

Over Rated Supply

1.2

°C/V

OUTPUTS

Output High Voltage, TMP04

µA

V+ – 0.4

V

Output Low Voltage, TMP04

µA

0.4

V

Output Low Voltage, TMP03

0.2

V

POWER SUPPLY

Supply Range

V+

4.5

7

V

Supply Current

Unloaded

1.3

mA

NOTES

Electrical tests are performed at wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed

for standard product dice. Consult factory to negotiate specifications based on dice lot qualification through sample lot assembly and testing.

WARNING!

ESD SENSITIVE DEVICE

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the TMP03/TMP04 features proprietary ESD protection circuitry, permanent damage

may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

ABSOLUTE MAXIMUM RATINGS*

Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . +9 V

Maximum Open-Collector Output Voltage (TMP03) . . +18 V

Operating Temperature Range . . . . . . . . . . . –55

°C to +150°C

Dice Junction Temperature . . . . . . . . . . . . . . . . . . . . +175

°C

Storage Temperature Range . . . . . . . . . . . . –65

°C to +160°C

Lead Temperature (Soldering, 60 sec) . . . . . . . . . . . . +300

°C

*CAUTION

permanent damage to the device. This is a stress rating only and functional

operation at or above this specification is not implied. Exposure to the above

maximum rating conditions for extended periods may affect device reliability.

on unprotected units from high-energy electrostatic fields. Keep units in conduc-

tive foam or packaging at all times until ready to use. Use proper antistatic handling

procedures.

Package Type

Θ

JA

Θ

JC

Units

TO-92 (T9)

162

1

120

°C/W

SO-8 (S)

158

1

43

°C/W

TSSOP (RU)

240

1

43

°C/W

NOTE

1

Θ

DICE CHARACTERISTICS

Die Size 0.050

× 0.060 inch, 3,000 sq. mils

( 1.27

× 1.52 mm, 1.93 sq. mm)

For additional DICE ordering information, refer to databook.

ORDERING GUIDE

Accuracy

Temperature

Model

at +25 C

Range

Package

TMP03FT9

±3.0

XIND

TO-92

TMP03FS

±3.0

XIND

SO-8

TMP03FRU

±3.0

XIND

TSSOP-8

TMP03GBC

±3.0

+25

°C

Die

TMP04FT9

±3.0

XIND

TO-92

TMP04FS

±3.0

XIND

SO-8

TMP04FRU

±3.0

XIND

TSSOP-8

TMP04GBC

±3.0

+25

°C

Die