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TMP35GS 数据表(PDF) 5 Page - Analog Devices |
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TMP35GS 数据表(HTML) 5 Page - Analog Devices |
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5 / 16 page ![]() REV. C TMP35/TMP36/TMP37 –5– SUPPLY VOLTAGE – V 40 30 0 20 10 50 07 12 3 4 56 TA = 25°C, NO LOAD 8 TPC 7. Supply Current vs. Supply Voltage TEMPERATURE – C 40 30 0 20 10 50 50 125 25 0 25 50 75 100 a. V+ = 5V b. V+ = 3V NO LOAD a b TPC 8. Supply Current vs. Temperature (Shutdown = 0 V) TEMPERATURE – C 400 300 0 200 100 50 125 25 0 25 50 75 100 = V+ AND SHUTDOWN PINS LOW TO HIGH (0V TO 3V) VOUT SETTLES WITHIN ±1°C = V+ AND SHUTDOWN PINS HIGH TO LOW (3V TO 0V) TPC 9. VOUT Response Time for V+ Power-Up/Power- Down vs. Temperature TEMPERATURE – C 400 300 0 200 100 50 125 25 0 25 50 75 100 = SHUTDOWN PIN HIGH TO LOW (3V TO 0V) = SHUTDOWN PIN LOW TO HIGH (0V TO 3V) VOUT SETTLES WITHIN ±1°C TPC 10. VOUT Response Time for Shutdown Pin vs. Temperature TIME – µs 0 1.0 0.8 0.6 0.4 0.2 50 250 0 100 50 150 200 300 350 400 450 0 1.0 0.8 0.6 0.4 0.2 V+ = 3V SHUTDOWN = SIGNAL TA = 25 C V+ AND SHUTDOWN = TA = 25 C SIGNAL TPC 11. VOUT Response Time to Shutdown and V+ Pins vs. Time TIME – sec 70 0 60 50 40 30 20 10 80 90 100 110 0 100 200 300 400 500 600 a b c VIN = 3V, 5V a. TMP35 SOIC SOLDERED TO 0.5" x 0.3" Cu PCB b. TMP36 SOIC SOLDERED TO 0.6" x 0.4" Cu PCB c. TMP35 TO-92 IN SOCKET SOLDERED TO 1" x 0.4" Cu PCB TPC 12. Thermal Response Time in Still Air |
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