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LTP5902-IPM 数据表(PDF) 28 Page - Linear Technology |
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LTP5902-IPM 数据表(HTML) 28 Page - Linear Technology |
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28 / 30 page ![]() A d v a nce d I n fo rm a t i o n 28 Linear Technology / Dust Networks Eterna Datasheet 10.3 Soldering Information Eterna is suitable for both eutectic PbSn and RoHS-6 reflow. The maximum reflow soldering temperature is 260 ºC. 11.0 Regulatory and Standards Compliance LTP5901 is compliant with EU, FCC and IC radio frequency regulations. For specific information on regulations, test procedures, and labeling requirements, see the “LTP5901 Regulatory User Guide”. LTP5902 is compliant with EU, FCC and IC radio frequency regulations. For specific information on regulations, test procedures, and labeling requirements, see the “LTP5902 Regulatory User Guide”. 11.1 Compliance to Restriction of Hazardous Substances (RoHS) Restriction of Hazardous Substances (RoHS) is a directive that places maximum concentration limits on the use of cadmium (Cd), lead (Pb), hexavalent chromium (Cr+6), mercury (Hg), Polybrominated Biphenyl (PBB), and Polybrominated Diphenyl Ethers (PBDE). Dust Networks is committed to meeting the requirements of the European Community directive 2002/95/EC. This product has been specifically designed to utilize RoHS-compliant materials and to eliminate or reduce the use of restricted materials to comply with 2002/95/EC. The RoHS-compliant design features include: • RoHS-compliant solder for solder joints • RoHS-compliant base metal alloys • RoHS-compliant precious metal plating • RoHS-compliant cable assemblies and connector choices • Lead-free QFN package • Halogen-free mold compound • RoHS-compliant and 245 °C re-flow compatible Note: Customers may elect to use certain types of lead-free solder alloys in accordance with the European Community directive 2002/95/EC. Depending on the type of solder paste chosen, a corresponding process change to optimize reflow temperatures may be required. 12.0 References [ 1 ] IEEE Std. 802.15.4-2006: Wireless Medium Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area Networks (LR-WPANs) http://standards.ieee.org/getieee802/download/802.15.4-2006.pdf 13.0 Order Information LEAD FREE FINISH** PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTP5901IPC-IPMA???#PBF LTP5901 66-Lead (37.465mm x 24mm) PCB -40 °C to 85 °C LTP5902IPC-IPMA???#PBF LTP5902 66-Lead (42mm x 24mm) PCB -40 °C to 85 °C ** See http://www.linear.com/ or contact your sales representative to determine the three digit software version field, ???. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ |
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