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SWBF0B 数据表(PDF) 16 Page - Seoul Semiconductor |
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SWBF0B 数据表(HTML) 16 Page - Seoul Semiconductor |
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16 / 17 page ![]() Rev. 01 Rev. 01 February, 2013 February, 2013 www.acrich.com www.acrich.com Document No. : QP-7-07-18 (Rev.00) 공통_을 [ [16 16 /17] /17] 10. Soldering (3) Hand Soldering conditions Not more than 3 seconds @MAX 350C, under Soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products. Lead Free Solder Pre-heat 150~200℃ Pre-heat time 120 sec. Max. Peak-Temperature 260℃ Max. Soldering time Condition 10 sec. Max. 2.5~5 C / sec. o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o 240 C Max. 10 sec. Max. 2.5~5 C / sec. 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C 1~5 C / sec. o o o o 1~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead Free Solder Pre-heat 120~150℃ Pre-heat time 120 sec. Max. Peak-Temperature 240℃ Max. Soldering time Condition 10 sec. Max. |
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