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STTH5L04DEE 数据表(PDF) 4 Page - STMicroelectronics |
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STTH5L04DEE 数据表(HTML) 4 Page - STMicroelectronics |
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4 / 9 page ![]() Characteristics STTH5L04DEE 4/8 Doc ID 023261 Rev 1 Figure 7. Reverse recovery softness factor versus dlF/dt (typical values) Figure 8. Relative variation of dynamic parameters versus junction temperature S FACTOR 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0 50 100 150 200 250 300 350 400 450 500 IF=IF(AV) VR=320 V Tj=125 °C dIF/dt(A/µs) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 25 50 75 100 125 IF=IF(AV) VR=320 V Reference: Tj=125 °C IRM SFACTOR QRR Tj(°C) Figure 9. Transient peak forward voltage versus dlF/dt (typical values) Figure 10. Forward recovery time versus dlF/dt (typical values) V FP(V) 0 1 2 3 4 5 6 7 0 50 100 150 200 250 300 350 400 450 500 IF=IF(AV) Tj=125 °C dIF/dt(A/µs) t f (ns) r 0 20 40 60 80 100 120 140 0 50 100 150 200 250 300 350 400 450 500 IF=IF(AV) VFR=1.2V Tj=125 °C dIF/dt(A/µs) Figure 11. Junction capacitance versus reverse voltage applied (typical values) Figure 12. Thermal resistance junction to ambient versus copper surface under tab C(pF) 100 1 10 1 10 100 1000 F=1 MHz VOSC=30 mVRMS Tj=25 °C VR(V) Rth(j-a)(°C/W) 0 50 100 150 200 250 01 2345 678 9 10 PowerFLAT (3.3x3.3) SCu(cm²) epoxy printed board FR4, copper thickness=35µm |
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