X02

Characteristics

Doc ID 7480 Rev 4

3/11

Table 5.

Thermal resistances

Symbol

Parameter

Value

Unit

Junction to leads (DC)

TO-92

Max.

60

°C/W

Junction to tab (DC)

SOT-223

25

Junction to tab (DC)

SMBflat-3L

14

Junction to ambient (DC)

TO-92

150

SOT-223

60

SMBflat-3L

75

Figure 1.

Maximum average power

dissipation versus average

on-state current (full cycle)

Figure 2.

Average and DC on-state current

versus tab (SOT-223, SMBflat-3L) or

lead (TO-92) temperature

0.0

0.2

0.4

0.6

0.8

1.0

1.2

0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

P(W)

α = 180°

I

(A)

T(AV)

360°

α

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0

25

50

75

100

125

D.C. (SMBflat-3L)

D.C. (TO-92)

D.C. (SOT-223)

α = 180° (SMBflat-3L)

α = 180° (SOT-223)

α = 180° (TO-92)

T

or T

(°C)

lead

tab

I

(A)

T(AV)

Figure 3.

Average and DC on-state current

versus ambient temperature

Figure 4.

Relative variation of thermal

impedance junction to ambient

versus pulse duration

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

0

25

50

75

100

125

I

(A)

T(AV)

D.C. (SMBflat-3L)

D.C. (TO-92)

D.C. (SOT-223)

α = 180° (SMBflat-3L)

α = 180° (SOT-223)

α = 180° (TO-92)

T

(°C)

amb

K=[Z

/R

th(j-a)

0.01

0.10

1.00

1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05

TO-92

SOT-223

t (s)

p

SMBflat-3L