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A4910 数据表(PDF) 3 Page - Allegro MicroSystems |
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A4910 数据表(HTML) 3 Page - Allegro MicroSystems |
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3 / 36 page  Automotive 3-Phase MOSFET Driver A4910 3 Allegro MicroSystems, LLC 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com Table of Contents Specifications 1 Features and Benefits 1 Description 1 Applications 1 Typical Application Drawing 1 Selection Guide 2 Absolute Maximum Ratings 2 Thermal Characteristics 3 Pin-out Diagram and Terminal List 4 Functional Block Diagram 5 Electrical Characteristics 6 Supply and Reference 6 Gate Output Drive 6 Logic Inputs and Outputs 7 Logic Inputs and Outputs, Dynamic 7 Current Sense Amplifiers 8 Uncommitted Operational Amplifier 9 Protection 10 Characteristic Definitions 11 Timing Diagrams 12 Serial Interface Timing 12 Gate Drive Timing, Phase 12 Gate Drive Timing, COASTn 12 Propagation Delay Timing 13 Logic Truth Tables 14 Characteristic Performance 15 Functional Description 16 Input and Output Terminal Functions 16 Power Supplies 17 Gate Drives 17 Logic Control Inputs 19 Current Sense Amplifiers 20 Uncommitted Operational Amplifier 20 Diagnostics 20 DIAG Output 20 System Faults 20 MOSFET Faults 21 Fault Actions 23 Fault States 23 Fault Masking 23 Serial Interface 24 Configuration and Control Registers 25 Diagnostic Register 25 Serial Register Definition 27 Configuration Register 0 (Config0) 27 Configuration Register 1 (Config1) 27 Diagnostic Register 28 Mask Register 28 Run Register 29 Application Information 30 Dead Time Selection 30 Fault Blanking Time Selection 30 Bootstrap Capacitor Selection 30 Bootstrap Charging 30 Bootstrap Charge Management 31 VREG Capacitor Selection 31 Supply Decoupling 31 Power Dissipation 31 Braking 31 Current Sense Amplifier 32 Input/Output Structures 33 Layout Recommendations 34 Package Outline Drawing 35 Thermal Characteristics may require derating at maximum conditions, see Power Dissipation section Characteristic Symbol Test Conditions* Value Unit Package Thermal Resistance (Junction to Ambient) RθJA On 4-layer PCB based on JEDEC standard 23 ºC/W On 2-layer PCB with 3 in.2 of copper area each side 44 ºC/W Package Thermal Resistance (Junction to Pad) RθJP 2 ºC/W *Additional thermal information available on the Allegro website. |
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