MCP4641 datasheet(91/102 Pages) MICROCHIP

91 / 102 page

 2008-2013 Microchip Technology Inc.

DS22096B-page 91

MCP453X/455X/463X/465X

APPENDIX A:

REVISION HISTORY

Revision B (February 2013)

The following is the list of modifications:

Corrected MCP45x1 DFN package pinout.

Corrected Device Block Diagram.

Updated the Absolute Maximum Ratings †

with Total Power Dissipation values for each

package type.

Updated typical thermal values in Temperature

Characteristics table.

Corrected

labeling

Figure 2-1,

from

Section 2.0 “Typical Performance Curves”.

Also corrected Figure 2-4.

Appropriate 1.8V Graphs in Section 2.0 “Typi-

cal Performance Curves” now reference

Appendix B: “Characterization Data Analy-

sis”.

Added new Figure 2-66.

Corrected values in Figure 5-1.

Added description of wiper value on POR/BOR

(Section 5.2 “Wiper”).

10. Added new section Section 8.5 “Implementing

Log

Steps

with

Linear

Digital

Potentiometer”.

11. Added information in the Development Tools

Section

(Section 10.0

“Development

support”).

12. Updated

packaging

section

with

package

available landing pattern diagrams.

13. Added Appendix B: “Characterization Data

Analysis”.

14. Updated the format of the Absolute Maximum

Ratings † page in Section 1.0 “Electrical

Characteristics”.

15. Clarified actions of the POR in Section 4.1.1

“Power-on Reset”.

16. Removed Note 3 from Table 10-1.

Revision A (November 2008)

• Original Release of this Document.

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