MTS2916A

DS22259C-page 14

 2010-2013 Microchip Technology Inc.

SOP 24L Package Outline

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

112

13

24

0.016 typ

0.05 typ

D

L

GAUGE PLANE

SEATING PLANE

Symbol

Minimum

Typical

Maximum

Unit

A

—

—

2.642 (0.104)

mm (inch)

A1

0.102 (0.004)

—

—

mm (inch)

D

15.545 (0.612)

15.697 (0.618)

15.850 (0.624)

mm (inch)

E

7.417 (0.292)

7.518 (0.296)

7.595 (0.299)

mm (inch)

H

10.287 (0.405)

10.464 (0.412)

10.643 (0.419)

mm (inch)

L

0.533 (0.021)

0.787 (0.031)

1.041 (0.041)

mm (inch)

J

048°

Note 1:

JEDEC outline: M0-119 AA

2:

Dimensions “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions

and gate burrs should not exceed 0.25mm (0.010inch) per side.

3:

Dimensions “E” does not include inter-lead flash, or protrusions. Inter-lead flash and protrusions

shall not exceed 0.25mm (0.010 inch) per side.

Note:

The package drawing dimensions are expressed in inches.