SST12LP19E datasheet(6/23 Pages) MICROCHIP

6 / 23 page

DS70005041C

05/13

2.4 GHz High-Power, High-Gain Power Amplifier

SST12LP19E

Data Sheet

Electrical Specifications

The RF and DC specifications for the power amplifier interface signals. Refer to Table 4 for the DC voltage and

current specifications. Refer to Figures 4 through 14 for the RF performance.

Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute

Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and

functional operation of the device at these conditions or conditions greater than those defined in the

operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con-

ditions may affect device reliability.)

Input power to pin 2 (PIN). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5 dBm

Average output power from pins 6 and 7 (POUT)1 for 8-contact XSON . . . . . . . . . . . . . . . . . +26 dBm

1. Never measure with CW source. Pulsed single-tone source with <50% duty cycle is recommended. Exceeding the max-

imum rating of average output power could cause permanent damage to the device.

Average output power from pin 6 (POUT)1 for 6-contact XSON/X2SON. . . . . . . . . . . . . . . . . +26 dBm

Supply Voltage to pins1, 3, and 8 (VCC) for 8-contact XSON. . . . . . . . . . . . . . . . . . . . . -0.3V to +4.6V

Supply Voltage to pins 1, 3, and 6 (VCC) for 6-contact XSON/X2SON . . . . . . . . . . . . . -0.3V to +4.6V

Reference voltage to pin 4 (VREF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +3.3V

DC supply current (ICC)2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA

2. Measured with 100% duty cycle 54 Mbps 802.11g OFDM Signal

Operating Temperature (TA). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +85ºC

Storage Temperature (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40ºC to +120ºC

Maximum Junction Temperature (TJ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+150ºC

Surface Mount Solder Reflow Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C for 10 seconds

Table 3: Operating Range

Range

Ambient Temp

VDD

Industrial

-40°C to +85°C

3.3V

T3.1 75041

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