©2013 Silicon Storage Technology, Inc.

DS70005049C

05/13

Data Sheet

www.microchip.com

Features

• High gain:

– Typically 30 dB gain across 2.4–2.5 GHz over tempera-

ture 0°C to +85°C and 29 dB gain from -40°C to 0°C

• High linear output power:

– >24 dBm P1dB

- Single-tone measurement. Please refer to “Absolute

Maximum Stress Ratings” on page 5

– Meets 802.11g OFDM ACPR requirement up to 21 dBm

– ~3% added EVM up to 18 dBm for 54 Mbps 802.11g

signal 802.11n HT20 ACPR requirement up to 18 dBm

– Meets 802.11b ACPR requirement up to 21 dBm

• High power-added efficiency/Low operating cur-

rent for 802.11b/g/n applications

• Low idle current

• High-speed power-up/down

– Turn on/off time (10%- 90%) <100 ns

– Typical power-up/down delay with driver delay included

<200 ns

• Low shut-down current (~2 µA)

• Small variation over temperature

– ~1 dB gain/power variation between 0°C to +85°C

• Excellent on-chip power detection

– >15 dB dynamic range, dB-wise Linear Temperature

stable and load insensitive

• Input port matched to 50

Ω internally

• Both input and output ports are DC decoupled.

• Packages available

– 8-contact USON – 2mm x 2mm x 0.55mm

• All non-Pb (lead-free) devices are RoHS compliant

Applications

• WLAN (IEEE 802.11b/g/n)

•Home RF

• Cordless phones

• 2.4 GHz ISM wireless equipment

2.4 GHz High-Efficiency, High-Gain Power Amplifier

SST12LP20

SST12LP20 is a RF-matched power amplifier module based on the highly-reliable

InGaP/GaAs HBT technology. This amplifier includes DC blocks and provides both

input and output match to 50

amplifier typically provides 30 dB gain with 28% power-added efficiency at 21 dBm.

SST12LP20 has excellent linearity with typically 18 dBm at 3% EVM for 54 Mbps

802.11g modulation, while meeting 802.11g spectrum mask at 21 dBm. It requires

only two external bias components, and features easy board-level usage, along with

high-speed power-up/down control through a single combined reference voltage pin.

SST12LP20 is offered in an 8-contact USON package.