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MPZ2012 数据表(PDF) 4 Page - TDK Electronics

部件名 MPZ2012
功能描述  Chip Beads For power line MPZ series
PDF  13 Pages
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制造商  TDK [TDK Electronics]
网页  http://www.tdk.com
标志 TDK - TDK Electronics

MPZ2012 数据表(HTML) 4 Page - TDK Electronics

  MPZ2012 Datasheet HTML 1Page - TDK Electronics MPZ2012 Datasheet HTML 2Page - TDK Electronics MPZ2012 Datasheet HTML 3Page - TDK Electronics MPZ2012 Datasheet HTML 4Page - TDK Electronics MPZ2012 Datasheet HTML 5Page - TDK Electronics MPZ2012 Datasheet HTML 6Page - TDK Electronics MPZ2012 Datasheet HTML 7Page - TDK Electronics MPZ2012 Datasheet HTML 8Page - TDK Electronics MPZ2012 Datasheet HTML 9Page - TDK Electronics Next Button
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• All specifications are subject to change without notice.
(3/12)
001-08 / 20120925 / e9413_mpz
Chip Beads
For Power Line
MPZ Series MPZ1005
FEATURES
• TDK has manufactured MPZ1005 type as EMI countermeasure
product for power line.
• This type is the best for energy-saving in the low DC resistance.
• No cross talk with closed magnetic circuit structural design.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of power line noises of cellular phones, PCs, note PCs,
TVs, TV tuners, STBs, audio players, DVDs, DSCs, DVCs, game
machines, digital photo frames, car navigation system, PNDs, etc.
PRODUCT IDENTIFICATION
(1) Series name
(2) Dimensions L
W
(3) Type name
(4) Impedance
121: 120
 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping(reel)
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
SPECIFICATIONS
PACKAGING STYLE AND QUANTITIES
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
ELECTRICAL CHARACTERISTICS
Test equipment: E4991A or equivalent
Test tool
: 16192A or equivalent
Test temperature: 25±10°C
Conformity to RoHS Directive
MPZ 1005
S 121 C
T
(1)
(2)
(3) (4) (5) (6)
(7)
Operating temperature range
–40 to +85°C
Storage temperature range
–40 to +85°C(After mount)
Packaging style
Quantity
Taping
10000 pieces/reel
Part No.
Impedance
(
)[100MHz]
DC resistance
(
)max.
Rated current
(A)max.
MPZ1005S100C
10±5
0.025
2.0
MPZ1005S300C
30±10
0.035
1.7
MPZ1005S600C
60±25%
0.060
1.5
MPZ1005S121C
120±25%
0.090
1.2
MPZ1005Y900C
90±25%
0.100
1.2
0.1min.
1
±0.05
0.4
0.5
0.5
Weight: 1mg
Dimensions in mm
Natural
cooling
10s max.
Preheating
60 to 120s
Soldering
30 to 60s
230˚C
250 to 260˚C
180˚C
150˚C
Time(s)
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.



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