• All specifications are subject to change without notice.

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001-08 / 20120925 / e9413_mpz

SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD

PATTERN

SPECIFICATIONS

PACKAGING STYLE AND QUANTITIES

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

ELECTRICAL CHARACTERISTICS

Test tool

Test temperature: 25±10°C

CHARACTERISTICS(DERATING) about the rating current at 85°C or

more in temperature of the product.

RATED CURRENT vs. TEMPERATURE CHARACTERISTICS

(DERATING)

Thickness(T)

Weight

0.6±0.15mm

3mg

0.8±0.15mm

4mg

Operating temperature range

–55 to +125°C

Storage temperature range

–55 to +125°C(After mount)

Packaging style

Quantity

Taping

4000 pieces/reel

1.6±0.15

0.3±0.2

0.3±0.2

0.8

0.6

0.6

Dimensions in mm

Natural

cooling

10s max.

Preheating

60 to 120s

Soldering

30 to 60s

230˚C

250 to 260˚C

180˚C

150˚C

Time(s)

Part No.

Impedance

(

DC resistance

(

)max.

(A)max.

Thickness

T(mm)

MPZ1608B471A 470±25%

0.150

1.0

0.8

MPZ1608S300A 30±10



0.010

5.0

0.6

MPZ1608S600A 60±25%

0.020

3.5

0.6

MPZ1608S101A 100±25%

0.030

3.0

0.6

MPZ1608S121A 120±25%

0.045

2.0

0.6

MPZ1608S181A 180±25%

0.050

2.0

0.6

MPZ1608S221A 220±25%

0.050

2.2

0.8

MPZ1608S331A 330±25%

0.080

1.7

0.8

MPZ1608R391A 390±25%

0.120

1.2

0.8

MPZ1608S471A 470±25%

0.150

1.0

0.8

MPZ1608S601A 600±25%

0.150

1.0

0.8

MPZ1608S102A 1000±25%

0.300

0.8

0.8

MPZ1608Y600B 60±25%

0.030

2.3

0.8

MPZ1608Y101B 100±25%

0.040

2.0

0.8

MPZ1608Y151B 150±25%

0.050

1.8

0.8

MPZ1608Y221B 220±25%

0.100

1.5

0.8

MPZ1608D300B 30±10



0.060

1.8

0.8

MPZ1608D600B 60±25%

0.100

1.2

0.8

MPZ1608D101B 100±25%

0.150

1.0

0.8

0

1

2

3

4

5

6

–55 –35

–15

5

25

45

65

85

105

125

Temperature(˚C)

S300A

S600A

S101A

Y600B

B471A,S471A,S601A,D101B

S102A

Y221B

S331A

R391A,D600B

S221A

Y151B,D300B

S121A,S181A,Y101B