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数据搜索系统，热门电子元器件搜索 |
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STM32F050C4 数据表(PDF) 87 Page - STMicroelectronics |
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STM32F050C4 数据表(HTML) 87 Page - STMicroelectronics |
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87 / 97 page  STM32F050xx Package characteristics Doc ID 023683 Rev 1 87/97 Figure 34. UFQFPN32 - 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package outline 1. Drawing is not to scale. 2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life. 3. There is an exposed die pad on the underside of the UFQFPN package. This pad is used for the device ground and must be connected. It is referred to as pin 0 in Table 8: Pin definitions. Seating plane ddd C C A3 A1 A D e 9 16 17 24 32 Pin # 1 ID R = 0.30 8 E L L D2 1 b E2 A0B8_ME Bottom view Table 62. UFQFPN32 – 5 x 5 mm, 32-lead ultra thin fine pitch quad flat no-lead package mechanical data Dim. millimeters inches(1) Min Typ Max Min Typ Max A 0.5 0.55 0.6 0.0197 0.0217 0.0236 A1 0.00 0.02 0.05 0 0.0008 0.0020 A3 0.152 0.006 b 0.18 0.23 0.28 0.0071 0.0091 0.0110 D 4.90 5.00 5.10 0.1929 0.1969 0.2008 D2 3.50 0.1378 E 4.90 5.00 5.10 0.1929 0.1969 0.2008 E2 3.40 3.50 3.60 0.1339 0.1378 0.1417 e 0.500 0.0197 L 0.30 0.40 0.50 0.0118 0.0157 0.0197 ddd 0.08 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. |
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