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MMA-283136-R5 数据表(PDF) 8 Page - IXYS Corporation |
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MMA-283136-R5 数据表(HTML) 8 Page - IXYS Corporation |
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8 / 13 page ![]() MMA-283136-R5 28-31GHz 4W MMIC Power Amplifier Data Sheet October, 2012 MicroWave Technology, Inc. an IXYS Company, 4268 Solar Way, Fremont, CA 94538 510-651-6700 FAX 510-651-2208 WEB www.mwtinc.com MMA283136 Rev 1.4 data sheet is subject to change without notice. All rights reserved © 2012 Please visit MwT website www.mwtinc.com for information on other MwT MMIC products. Page 8 of 13 Applications The MMA283136 MMIC power amplifier is designed for use as a power stage amplifier in microwave transmitters. It is ideally suited for 28 to 31GHz band V-sat transmitter applications requiring excellent saturated output power and linearity performance. This amplifier is provided as a 5x5mm QFN package, and the packaged amplifier is fully compatible with industry standard high volume surface mount PCB assembly processes. Biasing and Operation The recommended bias conditions for best performance for high power applications the MMA283136 are VDD = 6.0V, Idsq = 2000mA. Performance improvements are possible depending on applications. For high linearity requirement at higher output power up to 27dBm/tone, recommended bias conditions are Vdd=5V, Idsq=3000mA. The drain bias voltage range is 5 to 6V and the quiescent drain current biasing range is 1200mA to 3000mA. A single DC gate supply connected to Vg will bias all the amplifier stages. Muting can be accomplished by setting Vg to the pinch-off voltage (Vp=-1.8V). The gate voltage (Vg) should be applied prior to the drain voltages (Vd1, Vd2, Vd3, and Vd4) during power up and removed after the drain voltages during power down. The RF input and output ports are DC decoupled internally. Typical DC supply connection with bi-passing capacitors for the MMA283136 is shown in following pages. Assembly Techniques GaAs MMICs are ESD sensitive. ESD preventive measures must be employed in all aspects of storage, handling, and assembly. MMIC ESD precautions, handling considerations, die attach and bonding methods are critical factors in successful GaAs MMIC performance and reliability. |
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